JPS614870U - リフロ−炉 - Google Patents

リフロ−炉

Info

Publication number
JPS614870U
JPS614870U JP1984084351U JP8435184U JPS614870U JP S614870 U JPS614870 U JP S614870U JP 1984084351 U JP1984084351 U JP 1984084351U JP 8435184 U JP8435184 U JP 8435184U JP S614870 U JPS614870 U JP S614870U
Authority
JP
Japan
Prior art keywords
heat
endless
resistant
reflow oven
claw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984084351U
Other languages
English (en)
Japanese (ja)
Other versions
JPH024781Y2 (en]
Inventor
三井 佐藤
森 奥山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP1984084351U priority Critical patent/JPS614870U/ja
Priority to DE3429375A priority patent/DE3429375C2/de
Publication of JPS614870U publication Critical patent/JPS614870U/ja
Application granted granted Critical
Publication of JPH024781Y2 publication Critical patent/JPH024781Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tunnel Furnaces (AREA)
JP1984084351U 1984-06-08 1984-06-08 リフロ−炉 Granted JPS614870U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1984084351U JPS614870U (ja) 1984-06-08 1984-06-08 リフロ−炉
DE3429375A DE3429375C2 (de) 1984-06-08 1984-08-09 Lötvorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984084351U JPS614870U (ja) 1984-06-08 1984-06-08 リフロ−炉

Publications (2)

Publication Number Publication Date
JPS614870U true JPS614870U (ja) 1986-01-13
JPH024781Y2 JPH024781Y2 (en]) 1990-02-05

Family

ID=13828096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984084351U Granted JPS614870U (ja) 1984-06-08 1984-06-08 リフロ−炉

Country Status (2)

Country Link
JP (1) JPS614870U (en])
DE (1) DE3429375C2 (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181966A (ja) * 1988-01-13 1989-07-19 Matsushita Electric Ind Co Ltd 基板加熱装置
CN111545857A (zh) * 2020-06-02 2020-08-18 常州市武进顺达精密钢管有限公司 冰箱蒸发器和冷凝器焊接用的高频感应钎焊炉及应用工艺

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3720912A1 (de) * 1986-07-03 1988-01-07 Licentia Gmbh Verfahren und anordnung zum reflow-loeten und reflow-entloeten von leiterplatten
DE3635448C1 (en) * 1986-10-18 1988-01-21 Sab Schumacher Appbau Gmbh & C Method and device for reflow soldering of electronic components on printed circuit boards, conforming with SMD technology
JPS6471571A (en) * 1987-09-11 1989-03-16 Senju Metal Industry Co Reflow furnace
DE3737565A1 (de) * 1987-11-05 1989-05-24 Ernst Hohnerlein Verfahren und vorrichtung zum loeten
DE3806753A1 (de) * 1988-03-02 1989-09-14 Heino Pachschwoell Loet- und/oder aushaertvorrichtung
US4973244A (en) * 1988-06-08 1990-11-27 Electrovert Limited Heating system in the manufacture of printed circuit boards, assemblies and the like
DE3837531A1 (de) * 1988-11-04 1990-05-10 Siemens Ag Heissluft-reflow-ofen
DE3841447C1 (en]) * 1988-12-09 1990-08-02 Heraeus Quarzschmelze Gmbh, 6450 Hanau, De
US6146448A (en) * 1998-11-02 2000-11-14 Soltec B.V. Flux management system for a solder reflow oven
US7303109B2 (en) * 2003-07-01 2007-12-04 Asm Technology Singapore Pte Ltd. Stud bumping apparatus
JP4787379B1 (ja) * 2011-02-17 2011-10-05 吉政 玉井 コンパクトテーブル

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2435884A1 (fr) * 1978-09-07 1980-04-04 Cit Alcatel Machine a souder un connecteur a une plaque de circuit imprime

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181966A (ja) * 1988-01-13 1989-07-19 Matsushita Electric Ind Co Ltd 基板加熱装置
CN111545857A (zh) * 2020-06-02 2020-08-18 常州市武进顺达精密钢管有限公司 冰箱蒸发器和冷凝器焊接用的高频感应钎焊炉及应用工艺
CN111545857B (zh) * 2020-06-02 2024-10-22 常州市武进顺达精密钢管有限公司 冰箱蒸发器和冷凝器焊接用的高频感应钎焊炉及应用工艺

Also Published As

Publication number Publication date
JPH024781Y2 (en]) 1990-02-05
DE3429375A1 (de) 1985-12-12
DE3429375C2 (de) 1987-02-26

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